Short for Flip-Chip Pin Grid Array, Flip Chip is a design process developed by Intel of flipping the chip die to face away from the motherboard. This method allows for easy mass-production of computer processors by eliminating the need for wire bonding and allows a heat sink to have more of a direct contact. To the right is an example of a PC-PGA processor, the Intel Pentium III coppermine.
Short for Flip-Chip Pin Grid Array, Flip Chip is a design process developed by