FC-PGA
Updated: 04/26/2017 by Computer Hope

Short for Flip-Chip Pin Grid Array, an FC-PGA or flip chip is a design process developed by Intel of flipping the chip die to face away from the motherboard. This method facilitates the easy mass-production of computer processors by eliminating the need for wire bonding and allows a heat sink to have more of a direct contact. The picture is of the Intel Pentium III coppermine and an example of an FC-PGA processor.